MIPI Alliance Highlights Member Demos and New Specifications at Mobile Asia Expo

MIPI Alliance will host 6 member companies in its booth at the 2012 Mobile Asia Expo, June 20-22 in Shanghai, China. In addition, the industry-leading mobile interface standards organization will announce two updated specifications – the optimized physical layer M-PHY v2.0 with high bandwidth capabilities, and the UniPro v1.41 unified, layered protocol stack  which builds on the physical layer.

The following member companies will demo in the MIPI Alliance booth:

Arasan Chip Systems, Inc. – Arasan Chip Systems will demonstrate its Hardware Validation Platform for UFS/UniPro/MPHY which enables early software development and hardware validation and test.

Cadence Design Systems, Inc. will demonstrate its pre-silicon verification IPs for Mobile standards including MIPI LLI, M-PHY, UniPro and AMBA 4  ACE.

Synopsys, Inc.- Synopsys will demonstrate its proven and complete MIPI hardware prototyping solution, which includes DesignWare® MIPI CSI-2, DSI, and D-PHY IP connected to an off-the-shelf CSI-2 image sensor and DSI display IC.

Tektronix, Inc. will demonstrate the" Industry’s Most Complete M-PHY Automated Test Solutions  with Widest Test Coverage of Transmitter, Receiver and Protocols testing”.