USB 2.0 remains a critical connectivity technology across a wide range of semiconductor applications. While newer USB standards provide higher bandwidth, USB 2.0 continues to offer an excellent combination of performance, interoperability, implementation maturity, and cost efficiency.
For SoC designers, however, integrating a USB interface is not simply about selecting a protocol. The physical layer plays a critical role in achieving reliable signal integrity, interoperability, and USB compliance.
Arasan’s USB 2.0 Certified PHY IP provides a proven physical-layer solution designed to simplify USB integration across a broad range of semiconductor process technologies and manufacturing platforms.
USB 2.0 Certification for Design Confidence
Arasan’s USB 2.0 Certified PHY provides SoC designers with a proven solution for implementing USB connectivity.
Certification helps provide confidence that the PHY is designed to meet the requirements of the USB 2.0 specification and operate reliably within the USB ecosystem.
For semiconductor companies developing products across multiple market segments, a certified PHY can help reduce integration and compliance risks while accelerating product development.
supporting Process Nodes Down to 180nm
One of the key advantages of Arasan’s USB 2.0 PHY solution is its support for process nodes down to 180nm.
As advanced semiconductor designs increasingly move toward smaller process geometries, many applications continue to rely on mature nodes because of their:
• Cost efficiency
• Manufacturing maturity
• Proven reliability
• Availability of established design ecosystems
• Suitability for mixed-signal and embedded applications
Supporting mature process technologies allows USB 2.0 connectivity to be integrated into SoCs where leading-edge process technology may not be necessary or economically practical.
Multi-Foundry Flexibility
Semiconductor companies often need flexibility in selecting their manufacturing partner. A USB PHY that supports multiple foundries can provide greater freedom when planning SoC production and technology migration.
Arasan’s USB 2.0 PHY is designed to support implementation across multiple foundry options, helping customers address their specific manufacturing and technology requirements.
This flexibility can be particularly valuable for:
• Multi-source manufacturing strategies
• Long-life semiconductor products
• Automotive and industrial applications
• Cost-sensitive SoCs
• Designs requiring mature process technologies
A Practical Solution for USB 2.0 SoC Integration
The USB PHY forms the physical interface between the USB controller and the external USB connection. Its implementation directly affects the reliability and interoperability of the overall USB solution.
Arasan’s USB 2.0 PHY is designed to provide a proven physical-layer solution that can be integrated into SoCs across a wide range of applications and semiconductor technologies.
By combining USB 2.0 certification, mature-node support, and multi-foundry flexibility, Arasan addresses several of the key challenges faced by semiconductor designers.
Why Choose Arasan USB 2.0 PHY?
With decades of experience developing semiconductor IP, Arasan understands the challenges associated with integrating standards-based connectivity into complex SoCs.
The Arasan USB 2.0 Certified PHY, supporting process nodes down to 180nm and multiple foundries, gives semiconductor designers the flexibility to select an implementation that aligns with their technology, manufacturing, and product requirements.
Conclusion:
USB 2.0 remains an important connectivity technology even as the industry moves toward higher-speed USB standards.
For applications built on mature process technologies, the availability of a USB 2.0 Certified PHY supporting nodes down to 180nm and multiple foundries can provide an important combination of compliance, flexibility, and design confidence.
